J Neurol Surg A Cent Eur Neurosurg 2020; 81(02): 194
DOI: 10.1055/s-0040-1702205
Book Review
Georg Thieme Verlag KG Stuttgart · New York

Transnasal Endoscopic Skull Base and Brain Surgery

Veit Rohde
1   Department of Neurosurgery, Universitätsmedizin Göttingen, Goettingen, Germany
› Author Affiliations
Further Information

Publication History

Publication Date:
17 February 2020 (online)

Stamm AC, ed. Transnasal Endoscopic Skull Base and Brain Surgery. 2nd ed. Stuttgart, Germany: Thieme Publishers; 2019 (736 pages), ISBN: 978-1-62-623710-0

The second edition of the book Transnasal Endoscopic Skull Base and Brain Surgery was recently published. A huge effort was put into the project for covering almost every aspect of transnasal endoscopy. For better understanding and easier orientation, the book was divided into 14 parts. The basic knowledges of anatomy, imaging, and anesthesia are addressed in part I. In parts II to XI, the approaches to different target areas in the anterior, middle, and posterior cranial fossae are presented in great detail and with abundant intraoperative photographs. In some of the parts, treatment of specific disease entities is also described. A more uniform structure of the parts II to XI and of each chapter would have improved the readability and avoided redundancies. Furthermore, I missed a more critical discussion of advantages and disadvantages of endoscopic skull base surgery compared with its microsurgical alternatives. Part XII addresses the role of endoscopic surgery in children and part XIII, the management of cerebrospinal fluid leaks and meningoceles. Part XIV covers the very important topic of complications and their management.

For ENT surgeons and neurosurgeons with interest in endoscopic skull base surgery, the book is a must-have on the book shelf. For those who just started with endoscopic skull base surgery, the book offers a wealth of information, and for those who already have experience, the book allows pushing the borders further to yet unreached skull base targets.